FPC

Modular-Jack

HEADER

Board to Board

Cable

USB

Wafer

HDMI

SATA

D-SUB

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B22DXXVD100XDX-210

2.54ph Box HDR DIP VT 2Rows 8.8H

Type Box

Pitch (mm)2.54

Mounting TypeDIP

Connect AngleVertical

Contact Row2

Housing Layer1

Height (mm)

Housing MaterialPBT/PA6T

FlammabilityUL94V-0

Contact MaterialBrass

Shell Material

Contact FinishGold

Shell Finish

Insertion Force (N max.)

Withdrawal Force (N max.)

Durability (Cycles)

Fitting Nail Material

Fitting Nail Finish

Screw Finish

Boardlock Finish

Rivet Finish

Screw Material

Boardlock Material

Rivet Material

Actuator Material

Operaring Voltage(V)

Contact Rating(A) 3

Contact Resistance(mΩ max.)20

Insulation Resistance(MΩ min.)1000

Dielectric Withstanding Voltage(V /1 min.)1000